Advanced semiconductor process reprocessing and stacking of multiple layers and/or multiple thin wafers, typically warpage and warpage.
When the warpage exceeds a certain range, it will be difficult for the existing automated processing platform, because it is difficult to grasp the wafer, which may eventually lead to damage to the wafer.
By designing and selecting the correct vacuum nozzle, we can securely and precisely transfer delicate wafers regardless of warpage and diameter. Can significantly improve process yield and throughput.